Description
Product Overview
BGA Lead Solder Balls (25:000 balls) (0.6mm) is a BGA solder balls built for reballing compatible BGA packages during component-level rework. Ball diameter is a critical matching point because different IC packages and stencil patterns require different solder-ball sizes. For a repair shop, that means less guesswork when choosing the correct part or tool and a cleaner match to the job on the bench.
Key Features & Specifications
- Product type: BGA solder balls
- Listed size / quantity / rating: 0.6mm
- Approx. 25,000 lead solder balls
- Ball size: 0.6 mm
- For BGA soldering rework






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