Description
Product Overview
Use Bach 1.0 – Underfill Removal Blade when the job involves controlled IC, CPU, underfill, glue, or logic-board cleanup during microsoldering service. This board-level repair blade is specified for the exact application shown in the listing. Blade geometry is important around dense components because access angle and edge width affect how precisely material can be removed. The result is a more predictable repair workflow, especially when similar-looking parts or tools differ by model, size, or revision.
Key Features & Specifications
- Product type: board-level repair blade
- Bach 1.0 underfill-removal blade
- 2 mm blade
- For removing underfill around IC chips
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