Description
Product Overview
Bach 2.0 – IC Edge Glue Removal Blade is intended for controlled IC, CPU, underfill, glue, or logic-board cleanup during microsoldering service. As a board-level repair blade, it addresses a specific service need rather than acting as a universal substitute. Blade geometry is important around dense components because access angle and edge width affect how precisely material can be removed. Confirm the listed variant before installation so the repair matches the device or bench process correctly.
Key Features & Specifications
- Product type: board-level repair blade
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