Bach 3.0 – Logic Board And IC Chip Cleaning Blade

Product Overview

Bach 3.0 – Logic Board And IC Chip Cleaning Blade is a board-level repair blade built for controlled IC, CPU, underfill, glue, or logic-board cleanup during microsoldering service. Blade geometry is important around dense components because access angle and edge width affect how precisely material can be removed. For a repair shop, that means less guesswork when choosing the correct part or tool and a cleaner match to the job on the bench.

Key Features & Specifications

• Product type: board-level repair blade