Description
Product Overview
For technicians handling reballing compatible BGA packages during component-level rework, BGA Lead Solder Balls (25:000 balls) (0.4mm) provides the specific BGA solder balls required for the task. Ball diameter is a critical matching point because different IC packages and stencil patterns require different solder-ball sizes. It is a practical shop choice when accuracy matters more than substituting a generic part, tool, or consumable.
Key Features & Specifications
- Product type: BGA solder balls
- Listed size / quantity / rating: 0.4mm
- Approx. 25,000 lead solder balls
- Ball size: 0.4 mm
- For BGA soldering rework






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