Description
Product Overview
BGA Lead Solder Balls (25:000 balls) (0.5mm) is intended for reballing compatible BGA packages during component-level rework. As a BGA solder balls, it addresses a specific service need rather than acting as a universal substitute. Ball diameter is a critical matching point because different IC packages and stencil patterns require different solder-ball sizes. Confirm the listed variant before installation so the repair matches the device or bench process correctly.
Key Features & Specifications
- Product type: BGA solder balls
- Listed size / quantity / rating: 0.5mm
- Approx. 25,000 lead solder balls
- Ball size: 0.5 mm
- For BGA soldering rework






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